Intel has integrated power amplifiers and its 3G/HSPA RF circuits onto a single 65nm die in a new SoC called SMARTi UE2p. The SoC aims to reduce footprint and complexity for developers. This solution is targeted at new mass market segments such as entry level 3G handsets and machine-to-machine modules.
The integration of power management and sensors allows direct connection to the device battery. The SMARTi UE2p supports multiple 3G dual band configurations for global operation with the Intel XMM62xx HSPA slim modem family.
“The SMARTi UE2p will simplify the product development and supply chain logistics with the reduction in component count and system complexity,” said Stefan Wolff, vice president of the Intel Architecture Group and general manager of Multi-Com. “This will allow our customers to introduce lower-cost 3G handsets and support the transition of the machine-to-machine market segment toward 3G-based connected devices to help enable the ‘Internet of things.’”