Black Sand has been selected to provide silicon PA technology for integrated RF front end products by Murata. The products will be used to increase integration and improve the performance of 3G smartphones, tablets and datacards.
The agreement will combine Murata’s cellular RF front-end technologies with Black Sand’s CMOS PA technology; the companies hope to deliver a winning combination of performance and cost. Integrating the PA together with other RF front-end components into a single module will enable better optimisation of performance, battery current, size, and cost.
“Black Sand’s silicon PA technology stands out against the competition,” said Norio Nakajima, Vice President of the Module Business Unit at Murata. “Tier 1 cellular manufacturers are demanding increasing levels of sophistication and integration throughout the handset, and RF is no exception. At Murata we are excited about leveraging Black Sand’s technology to produce world-leading RF front-end products in terms of performance, size, and cost.”
“Black Sand is proud to have been selected for this development by a company of the calibre of Murata,” said John Diehl, CEO of Black Sand. “This agreement represents a major opportunity for both companies: industry estimates tell us that the market for RF front end components is growing at a CAGR of around 15%, and will reach in excess of $5.5bn by 2014. A year after we entered production with the BST34 Series devices, entering this relationship is a powerful endorsement of our technology and our ability to deliver.”
Black Sand’s PAs improve the reliability and data throughput of 3G smartphones, tablets and datacards, while benefiting from the reliability and economies of scale derived from pure CMOS manufacturing.
Mobile device manufacturers have long sought a viable CMOS alternative to GaAs that will enable them to benefit from an improved supply chain, higher reliability, and lower cost.