TTI says it is the first Pan-European distributor to stock Semelab’s recently-introduced DLCC family of hermetic ceramic leadless chip carrier packages for diodes which has been designed for all high reliability applications including space, aerospace, high temperature and military programmes.
Comments Ros Kruger, Industry Marketing Director, Europe – Military, Aero and Space for TTI: “Semelab has 30 years experience in the manufacture of semiconductor devices for high reliability applications. Designed as a cost-effective solution and manufactured in accordance with MIL-19500 and ESA specifications, the new DLCC packages are perfectly suited to meet the challenges of harsh environments.“
The DLCC package design takes full advantage of the high reliability pedigree of the HTCC surface mount packaging technology, which is easily integrated for automated assembly. Semelab has taken the existing standards for ceramic surface mount package manufacture and added additional design features to enhance thermal performance, looking to present a competitive alternative for high reliability applications.
The physical dimensions for the DLCC ceramic packages are designed to fully utilise the recommended solder footprint for the popular MELF packages, and are therefore a drop in replacement for existing board design.
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