New products hit the shelves at two leading distributors this week.
Gleichmann Electronics has expanded its product portfolio with four new low-voltage PowerMOSFETs, type numbers N0100P, N0301P, N0302P and N0301N, from NEC Electronics. Package heights of the new MOSFETs are reduced by 0.1 mm compared to devices in normal SOT‑23 packages. A further reduction of the package height was made possible by employing a flat lead structure, whereby the solder contacts protrude flat from the package. Thanks to the flat lead structure, the package can accommodate larger chips. As a result, this enables a reduction of on-resistance by up to 20 percent compared to MOSFETs in SOT23 package. The new MOSFETS are thereby capable of achieving up to 4.5 A (N0301N) of current. Data sheets and samples of the four new devices - three P-channel MOSFETs and one N-channel MOSFET - are available now. Mass production is scheduled to begin in June 2009.
Mouser Electronics is stocking FTDI’s dual speed FT2232H and quad speed FT4232H USB 2.0 high-speed Evaluation Mini-Modules that support the new FT2232H and FT4232H USB 2.0 high-speed interface ICs. The USB2.0 Evaluation Mini-Modules feature Multi-Protocol Synchronous Serial Engines (MPSSE) which are capable of speeds up to 30Mbits/s and provide flexible interface configurations. The small High-speed Evaluation Mini-Modules can be configured in a variety of industry standard serial or parallel interfaces such as UART or FIFO. Mike Scott, Vice President of Active Products for Mouser, states, “FTDI provides practical USB interface solutions with their new High-Speed Mini-Modules that allow customers to quickly evaluate the FT2232H and FT4232H devices and drivers prior to commencing their own design. Mouser’s time to market advantage provides design engineers and small quantity buyers with the tools they need to get their design up, running, and on the market as quickly as possible.” .
Comments