In modern automotive systems, various bus systems, rigid safety demands and the need for high performance at low power have to be balanced. While there are many specialized automotive chips like microcontrollers and SoCs around, this is an area where the general trend towards higher integration finally makes sense.
Applications are the control of combustion engines, electrical and hybrid vehicles, transmission control units, chassis domains, braking systems, electrical power steering systems, airbags and advanced driver assistance systems. In addition, the architecture used for AURIX allows a reduction in workload to develop safety systems compliant with the ASIL D standard. Compared to a classical Lockstep architecture safety development efforts may be reduced by 30 percent, Infineon says. Furthermore, up to 100 percent performance surplus allows for more functionality and sufficient resource buffer for future requirements. Additionally, to serve upcoming security requirements for better protection of automotive applications from theft, fraud and tampering, members of the AURIX family feature a built-in Hardware Security Module (HSM).
The multicore architecture was developed according to an audited ISO26262 compliant process and designed to efficiently meet ASIL D on application level. Josef Bast, head of powertrain electronics development at the Audi AG in Ingolstadt, Germany, gives praise:
»The AURIX microcontroller family with its best-in-class real-time performance and high processing power enables to meet the increasing requirements of our next generation engine platforms: lower CO2 emissions at increased engine performance«.
Anticipating upcoming security and protection requirements Infineon has integrated a programmable hardware security module (HSM) into the AURIX family. The HSM uses a hardware-based encryption technology and acts as an »embedded chip card« that may enhance protection against attacks of IP infringement, fraud and software hijacking.
The family comes with various fully modular components from the ultra high end to the low end ensuring long-term design flexibility. The portfolio comprises 300 MHz triple core devices with 8 MByte embedded Flash (eFlash), 200 MHz triple core devices with 4 MByte eFlash, 200 MHz dual core devices with 2.5 MByte eFlash, as well as 130 MHz and 80 MHz single core and single core lockstep devices with 1.5 MByte, 1 MByte and 0.5 MByte of eFlash. The package options include BGA-516 package with a ball-compatible BGA-292 package (I/O subset), and compatible LQFP-176, LQFP-144, LQFP-100 and LQFP-64 packages.
All AURIX family members are manufactured in a 65 nm embedded Flash technology designed for reliability in the harsh automotive environment. To ensure a continuous supply, Infineon has set-up a dual frontend supply concept with two locally separated production sites using identical certified processes and tooling. The development tool chain includes highly optimizing C/C++ cross compilers, debuggers as well as dedicated measurement, calibration and diagnostics tools. All typical issues of multicore software development such as correctness, performance and scalability are addressed with enriched compiler versions and well established timing and scheduling analysis tools. Several simulation packages facilitate model based development of customer circuitry around AURIX devices and can be connected to modeling environments such as Matlab and Simulink.
A free-of-charge TriCore entry tool chain comprising a fully functional GNU C Compiler including Debugger and an Eclipse based development environment can be downloaded here. Infineon provides MC-ISAR low-level drivers based on the AUTOSARv4 MCAL (Microcontroller Abstraction Layer) and support for the upcoming v3.2. This allows designs to take full advantage of an AUTOSAR-based development process at the control unit level. Currently the implementation of an ASPICE certification is still continuing.