The Korean foundry Dongbu HiTek is reaching for the stars: Specialized on analog and mixed signal semiconductor technologies, it’s trying to expand its business into automotive ICs. Its process technologies have undergone high-quality automotive certifications and now they’re ready for more.
The foundry has got some experience with automotive certifications. In 2003 it has earned the ISO/TS 16949 certification for manufacturing automotive ICs. H.S. Park, VP of Quality & Reliability, claims they’ve been one of the very first foundries to get this approval at that time. As for the new developments he states: “We have been accelerating our drive into implementing automotive ICs over the past two years, investing significant time and resources into this effort.”
Specific CMOS (MS180, Mixed-Signal 180 nm) and BCDMOS (BD350, 0.35 µm) process technologies have been qualified to meet the quality/reliability standards set forth in AEC-Q100, Revision F, per highest level “Grade 0”.
“Our enhanced IP for implementing EEPROM functions with our BD350 process offers the flexibility to finely trim analog parameters such as voltages and currents in the package to reduce development time by up to six months”, asserted Park, addressing automotive OEMs in the hope for new business opportunities. According to the technical specs, the chips are supposed to operate reliably at 150 °C over a lifetime of more than 10 years. The CMOS process supports operating voltages between 2.5 V and 5.5 V. The performance capabilities for the BD180 process will be specified soon.
The complete process package of MS180 and BD350 includes SPICE models for 180 °C and 150 °C component characterization and all IP- and NVM-blocks. Furthermore it includes differentiated automotive specific IP blocks, the use of two certified Wafer fabs and partnerships with select design houses and IP providers.
As for now, Dongbu HiTek manufactures AEC-Q100 qualified Ethernet ICs for Micrel and LIN-Chips using the BD350 process in cooperation with Triune Systems.
Specific CMOS (MS180, Mixed-Signal 180 nm) and BCDMOS (BD350, 0.35 µm) process technologies have been qualified to meet the quality/reliability standards set forth in AEC-Q100, Revision F, per highest level “Grade 0”.
“Our enhanced IP for implementing EEPROM functions with our BD350 process offers the flexibility to finely trim analog parameters such as voltages and currents in the package to reduce development time by up to six months”, asserted Park, addressing automotive OEMs in the hope for new business opportunities. According to the technical specs, the chips are supposed to operate reliably at 150 °C over a lifetime of more than 10 years. The CMOS process supports operating voltages between 2.5 V and 5.5 V. The performance capabilities for the BD180 process will be specified soon.
The complete process package of MS180 and BD350 includes SPICE models for 180 °C and 150 °C component characterization and all IP- and NVM-blocks. Furthermore it includes differentiated automotive specific IP blocks, the use of two certified Wafer fabs and partnerships with select design houses and IP providers.
As for now, Dongbu HiTek manufactures AEC-Q100 qualified Ethernet ICs for Micrel and LIN-Chips using the BD350 process in cooperation with Triune Systems.
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